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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IST |
2022-03-28
09:30 |
Online |
(Online) |
3-Layer Stacked Pixel-Parallel CMOS Image Sensors Using Hybrid Bonding of SOI Wafers
Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (The Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (The Univ. of Tokyo) |
We report 3-layer stacked pixel-parallel CMOS image sensors developed for the first time. The hybrid bonding of silicon-... [more] |
IST2022-11
pp.5-8 |
| IST |
2020-03-27
13:30 |
Tokyo |
Kikaishinko kaikan (Tokyo)
(Postponed) |
High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
Shunsuke Maruyama, Shuji Manda, Ryosuke Matsumoto, Suguru Saito, Hideki Minari, Takaaki Hirano, Taizo Takachi, Nobutoshi Fujii, Yuichi Yamamoto, Yoshifumi Zaizen, Tomoyuki Hirano, Hayato Iwamoto (SSS) |
We developed a back-illuminated InGaAs image sensor with 1280x1024 pixels at 5-um pitch by using Cu-Cu hybridization con... [more] |
IST2020-16
pp.35-39 |
| IST |
2019-09-20
13:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. (Tokyo) |
Digital Pixel Image Sensors with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3-D Integration
Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) |
We report digital pixel image sensors developed by using pixel-wise three-dimensional (3D) integration technology. Photo... [more] |
IST2019-47
pp.17-20 |
| BCT, IEEE-BT |
2015-10-23
14:35 |
Yamagata |
Yamagataterrsa (Yamagata) |
[Invited Lecture]
On Received Frame Sharing Protocol for Collaborative Interference Cancellation
Daisuke Umehara (Kyoto Inst. of Tech.) |
Let us assume that space division multiplexing (SDM) signal without precoding is transmitted at a base station (BS) with... [more] |
BCT2015-71
pp.9-12 |
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