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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
IEICE-ICD, IEICE-SDM, IST [detail] |
2024-08-06 15:00 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation and analysis of thermal characteristics near the chip in 3D stacked chips Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2023-08-01 10:45 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
A research on a cryogenic ADC for acquisition of environmental noise near quantum devices. Tomoya Yamada, Ryozo Takahashi, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2023-08-01 11:10 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature Misato Taguchi, Ryozo Takahashi, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08 15:05 |
Online |
On-line |
Evaluation of Backside Voltage Disturbance Impacts and IC Chip Response in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2022-08-08 15:55 |
Online |
On-line |
A cryogenic digital-to-analog converter for high-fidelity control of large-scale qubit arrays Ryozo Takahashi, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-SDM, IEICE-ICD, IST [detail] |
2021-08-18 15:35 |
Online |
Online |
On-chip multi-channel noise sensor circuits to detect off-chip security attacks Ryozo Takahashi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2020-08-06 13:50 |
Online |
Online |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) |
[more] |
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IST, IEICE-ICD |
2014-07-03 10:25 |
Shimane |
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Design of 1mm-Pitch 80x80-Channel 322Hz-Frame-Rate Touch Sensor with Two-Step Dual-Mode Capacitance Scan Noriyuki Miura (Kobe Univ.), Shiro Dosho (Pana.), Daisuke Fujimoto, Takuya Kiriyama (Kobe Univ.), Hiroyuki Tezuka, Takuji Miki (Pana.), Makoto Nagata (Kobe Univ.) |
A 1mm-pitch 80x80-channel 322Hz-frame-rate capacitive touch sensor has been developed. Multiple touch points are detecte... [more] |
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