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Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
IEICE-ICD, IEICE-SDM, IST [detail] |
2024-08-06 15:00 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation and analysis of thermal characteristics near the chip in 3D stacked chips Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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IEICE-ICD, IEICE-SDM, IST [detail] |
2020-08-06 13:50 |
Online |
Online |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) |
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