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All Technical Committee Conferences (Searched in: Recent 10 Years)
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| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IEICE-SDM, IEICE-ICD, IST [detail] |
2025-08-08
13:50 |
Hokkaido |
Hokkaido Univ. Multimedia Education Bldg. 3F
(Primary: On-site, Secondary: Online) |
Thermal Simulation for Evaluating Heat Dissipation and Leakage in Semiconductor Chip
Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagta (Kobe Univ.), Lang Lin, Norman Chang (Ansys) |
[more] |
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| IEICE-ICD, IEICE-SDM, IST [detail] |
2024-08-06
15:00 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation and analysis of thermal characteristics near the chip in 3D stacked chips
Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univ.) |
[more] |
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| IEICE-ICD, IEICE-SDM, IST [detail] |
2020-08-06
13:50 |
Online |
Online |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance
Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) |
[more] |
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