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All Technical Committee Conferences (Searched in: Recent 10 Years)
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| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| IST |
2025-11-21 13:30 |
Tokyo |
(Primary: On-site, Secondary: Online) |
[Invited Talk]
A Novel 1/1.3-inch 50 Megapixel three-wafer-stacked CMOS Image Sensor with DNN Circuit for Edge Processing Ryoichi Nakamura, Hidenobu Tsugawa, Wataru Otsuka, Kan Shimizu, Yoshihisa Kagawa, Kenta Ono, Yosuke Horie (Sony Semiconductor Solutions) |
This study reports the first ever 3-wafer-stacked CMOS image sensor comprising an artificial intelligence (AI) chip with... [more] |
IST2025-46 pp.1-4 |
| IST |
2025-03-21 10:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. (Primary: On-site, Secondary: Online) |
A Novel 1/1.3-inch 50 Megapixel Three-wafer-stacked CMOS Image Sensor with DNN Circuit for Edge Processing Yukihiro Tatsumi, Ryoichi Nakamura, Hidenobu Tsugawa, Kan Shimizu, Yoshihisa Kagawa, Kenta Ono, Yousuke Horie, Wataru Otsuka, Hayato Iwamoto (Sony Semiconductor Solutions) |
[more] |
IST2025-9 pp.1-4 |
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