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IEICE-ICD, IEICE-SDM, IST [detail] 2020-08-06
13:50		 Online Online Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance
Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) 		 [more]
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