| Paper Abstract and Keywords |
| Presentation |
2023-09-15 15:10
A 3.06 μm SPAD Pixel with Embedded Metal Contact and Power Grid on Deep Trench Pixel Isolation for High-resolution Photon-counting
Tatsuya Nakata, Jun Ogi, Fumiaki Sano, Yoshiki Kubo, Wataru Onishi, Charith Koswaththaghe, Takeya Mochizuki, Yoshiaki Tashiro, Kazuki Hizu, Takafumi Takatsuka, Fumihiko Koga, Tomoyuki Hirano, Yusuke Oike (SSS) |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
This paper presents a 3.06-μm-pitch SPAD pixel with the embedded metal contact and power grid on two-step deep trench isolation in the pixel. The embedded metal contact can suppress edge breakdown and can reduce dark count rate to 15.8 cps with the optimized potential design. The embedded metal for the contact is also used as an optical shield and low crosstalk probability 0.4% is achieved, while photon detection efficiency is as high as 57%. Additionally, the integration of a power grid and the polysilicon resistor on SPAD pixels can contribute to voltage drop reduction in anode power supply and power consumption reduction with SPAD multiplication, respectively. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
SPAD / High-resolution Photon-counting / Two-step Deep Trench Isolation / / / / / |
| Reference Info. |
ITE Tech. Rep., vol. 47, no. 27, IST2023-44, pp. 37-40, Sept. 2023. |
| Paper # |
IST2023-44 |
| Date of Issue |
2023-09-08 (IST) |
| ISSN |
Online edition: ISSN 2424-1970 |
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