Conference Information |
Committee |
IEICE-ICD IEICE-SDM IST |
Conference Date |
2020-08-06 - 2020-08-07 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Online |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications |
Paper Information |
Registration To |
IEICE-ICD |
Conference Code |
2020-08-ICD-SDM-IST |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance |
Sub Title (in English) |
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1st Author's Name |
Takuji Miki |
1st Author's Affiliation |
Kobe University (Kobe Univ.) |
2nd Author's Name |
Makoto Nagata |
2nd Author's Affiliation |
Kobe University (Kobe Univ.) |
3rd Author's Name |
Akihiro Tsukioka |
3rd Author's Affiliation |
Kobe University (Kobe Univ.) |
4th Author's Name |
Noriyuki Miura |
4th Author's Affiliation |
Osaka University (Osaka Univ.) |
5th Author's Name |
Takaaki Okidono |
5th Author's Affiliation |
ECSEC (ECSEC) |
6th Author's Name |
Yuuki Araga |
6th Author's Affiliation |
AIST (AIST) |
7th Author's Name |
Naoya Watanabe |
7th Author's Affiliation |
AIST (AIST) |
8th Author's Name |
Haruo Shimamoto |
8th Author's Affiliation |
AIST (AIST) |
9th Author's Name |
Katsuya Kikuchi |
9th Author's Affiliation |
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Speaker |
Author-1 |
Date Time |
2020-08-06 13:50:00 |
Presentation Time |
25 minutes |
Registration for |
IEICE-ICD |
Paper # |
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Volume (vol) |
vol.44 |
Number (no) |
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Page |
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#Pages |
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Date of Issue |
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